| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for a high frequency semiconductor device wherein possibility of generating electric fault like short circuit is eliminated even if thinning is performed by sufficiently maintaining shielding effect. <P>SOLUTION: In the package for a semiconductor device, a circuit element is arranged on a high frequency circuit board in which a ground electrode is formed, ground electrodes 4 to be connected to the ground electrode are arranged on two edges of the high frequency circuit board, and a metal cover 1 which has pawls 2 to be electrically connected to the ground electrodes on two edges is capped. In the package, structure is so formed that the two pawls 2 of the metal cover 1 in which pawls an inner wall of the metal cover 1 is subjected to insulating coating 7 are bent inside. The pawls 2 of the metal cover 1 are brought into contact with the ground electrodes 4 of the high frequency circuit board and electrically connected. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
