Optimized multiple heat pipe blocks for electronics cooling

摘要

An apparatus for removing heat from a heat generating device is disclosed. The apparatus comprises a plate thermally coupled to the heat generating device and thermally coupled to two beat pipes wherein each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. The apparatus can include one or more additional heat pipes coupled to the plate. The apparatus can include a heat spreader, wherein the heat spreader is in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.