ABRASIVE AND METHOD OF POLISHING

摘要

An abrasive comprising a slurry obtained by dispersing particles of a tetravalent metal hydroxide in a medium and an additive, wherein the additive is a polymer containing at least one monomer component selected from the group consisting of monomers represented by the general formulae (I) and (II) (wherein R1 is hydrogen, methyl, phenyl, benzyl, chloro, difluoromethyl, trifluoromethyl, or cyano; R2 and R3 are each hydrogen, C1-18 alkyl, methylol, acetyl, or diacetonyl, with the proviso that the case wherein both are hydrogen is excluded; and R4 is morpholino, thiomorpholino, pyrrolidinyl, or piperidino). The particles together with a film to be polished form a chemical reaction layer and the substrate is polished without abrasion flaws by virtue of a highly slight mechanical action of the particles and mechanical removal by a pad, the additive enabling the substrate to be highly flattened.