| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesion palette for conveying a substrate that can reduce a peel-off stress when a work substrate is peeled from a conveyance palette, assuming that the conveyance palette has adhesiveness, can improve the quality of a joint part with a semiconductor chip to be influenced by the peel-off stress, and can improve reliability. <P>SOLUTION: The adhesion palette is provided with a metal layer 3 that has rigidity and magnetism and is elastically deformable, an adhesion plate 2 that covers the upper entire surface of the metal layer 3 and adheres and holds the work substrate W in attachable and detachable manner, and a conveyance plate 1 that is covered with a magnetic layer 5 of which upper surface is magnetically joined with the metal layer forming the adhesion plate and is conveyed/driven while holding the adhesion plate. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
