| 摘要 |
PROBLEM TO BE SOLVED: To obtain a halogen-free resin composition having excellent heat-resistance, folding endurance and flexing resistance and meeting the increasing requirement for the fine wiring, high mounting density and high flexing resistance of a flexible printed circuit board according to the performance improvement and the miniaturization of electronic equipment and the requirement for a halogen-free material from the viewpoint of environmental problem. SOLUTION: This resin composition for flexible printed circuit board is used as an adhesive for flexible printed circuit boards. It contains a biphenyl aralkyl epoxy resin expressed by formula (1), a novolak phenolic resin as a curing agent and a polyamide imide as essential components. COPYRIGHT: (C)2005,JPO&NCIPI
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