| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows a lead terminal to be firmly connected to the input/output portion in each sidewall and with reliability and allows a semiconductor element housed in a semiconductor element housing package to operate normally and stably over a long period. SOLUTION: This semiconductor element housing package is equipped with a ceramic base 1, having a mount 1a for a semiconductor element 7 at the bottom of a recessed region in the top face, and input/output portions 3, each of which has a line conductor 4 penetrating through a sidewall 2 across the centers of the bottoms of two level differences 3a, provided in the inner and outer faces of the side wall 2 so that they are opposed to each other and has a lead terminal 6, that is brazed to the line conductor 4 on the outer face side of the sidewall 2. Multiple protrusions 4b, which have the same height and support a lead terminal 6 at the upper end, are provided on the line conductor 4 on the bottom of the level difference 3a on the outer face side of each sidewall 2 of the base 1 so that the protrusions extend in a direction perpendicular to the line direction of the line conductor 4 and are formed on both sides of the line conductor 4 in the line direction. COPYRIGHT: (C)2005,JPO&NCIPI
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