| 摘要 |
A pluggable connectorized package having an optical medium component and an optoelectronic element component in a sleeve. Alignment between these components may be maintained by the sleeve. The sleeve may have a slit, be slightly undersized relative to the components, and hold the components with a form of a grip. Or the sleeve may not have a slit and be machined along with the components to fit in the sleeve with close tolerances. The optical medium such as an optical fiber may be in a ferrule to be placed in the sleeve. The optoelectronic element may be in a ferrule-like device that may be referred to as a thimble. The thimble forms an environmentally protective housing for the original equipment chip with design options for full hermeticity as well as providing means of electrical interface. Additionally, this element may be configured to accommodate auxiliary chip-to-fiber coupling optics as required.
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