发明名称 METHOD FOR PRODUCING A LASER DIODE COMPONENT, HOUSING FOR A LASER DIODE COMPONENT, AND LASER DIODE COMPONENT ITSELF
摘要 The invention relates to a method for producing a laser diode component comprising an electrically insulating housing base body (1) and electrical supply leads (5a, 5b), which are guided out of the housing base body and which can be accessed from the outside of the housing base body (1). The housing base body (1) is made from a material, which is transparent to laser radiation to be radiated from the laser diode component, and comprises a chip mounting area (3). A beam axis (100) of the laser diode component passes through the housing base body (1). The invention also relates to a housing, which can be produced in the aforementioned manner, and to a laser diode component provided with a housing of this type.
申请公布号 WO2004107511(A2) 申请公布日期 2004.12.09
申请号 WO2004DE01086 申请日期 2004.05.26
申请人 OSRAM OPTO SEMICONDUCTORS GMBH;FERSTL, CHRISTIAN;GROETSCH, STEFAN;ZEILER, MARKUS 发明人 FERSTL, CHRISTIAN;GROETSCH, STEFAN;ZEILER, MARKUS
分类号 H01S3/00;H01S5/00;H01S5/022;H01S5/024 主分类号 H01S3/00
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