发明名称 |
WORKING METHOD OF PIEZOELECTRIC MATERIAL |
摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a piezoelectric element of high precision and high quality by working piezoelectric material in a prescribed three dimensional shape without introducing defect. <P>SOLUTION: After arranging a mask 14 which has prescribed thickness distribution on a piezoelectric material substrate 11, working is performed in the target three dimensional shape by dry etching using working speed difference between the piezoelectric material substrate 11 and the mask 14. Thickness distribution of the mask 14 is adjusted by reflow, contact bonding using a precision version 15, etc. The piezoelectric material substrate 11 can be also worked in a three dimensional shape wherein thickness distribution of the mask 14 is amplified by adjustment of gas composition used for the dry etching. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2004349365(A) |
申请公布日期 |
2004.12.09 |
申请号 |
JP20030142894 |
申请日期 |
2003.05.21 |
申请人 |
JAPAN SCIENCE & TECHNOLOGY AGENCY |
发明人 |
ABE TAKASHI;RI REI;ESASHI MASAKI |
分类号 |
H01L21/3065;C04B35/491;H03H3/02;H03H9/17 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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