| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing-die bonding tape which ensures stable adhesion of a die bonding layer for fixing a wafer that endures dicing and for facilitating picking up of a chip, and ensures excellent adhesiveness with a lead frame. SOLUTION: The adhesive tape for dicing-die bond is provided, which comprises a polyolefine substrate that has been subjected to corona treatment and an adhesive layer provided on the substrate, with a separation force between the adhesive layer and the substrate being 0.2-1.5N/25mm, and with the adhesive layer consisting of an adhesive composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst as essential components. By giving thermocompression to the adhesive layer of the tape and to a wafer, the wafer is fixed so as to endure dicing, and a chip being attached with the adhesive layer is readily picked up after dicing, thereby stabilizing adherence (adhesion) between the substrate film and the adhesive layer. The adhesion is further enhanced by subjecting the chip and the lead frame to thermocompression, followed by heating and curing. COPYRIGHT: (C)2005,JPO&NCIPI |
