| 发明名称 |
Flip chip package having protective cap and method of fabricating the same |
| 摘要 |
The flip chip package includes a semiconductor chip electrically connected to a circuit substrate. A protective cap is disposed over the semiconductor chip, and includes at least one portion extending beyond an edge of the semiconductor chip.
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| 申请公布号 |
US2004245653(A1) |
申请公布日期 |
2004.12.09 |
| 申请号 |
US20040766210 |
申请日期 |
2004.01.29 |
| 申请人 |
LEE YONG-KWAN;NAM TAE-DUK |
发明人 |
LEE YONG-KWAN;NAM TAE-DUK |
| 分类号 |
H01L21/60;H01L23/00;H01L23/433;(IPC1-7):H01L29/40 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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