| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of polishing semiconductor wafer which allows no chance of intrusion of a polishing liquid into between a backing pad and a semiconductor wafer during polishing. <P>SOLUTION: In the method of polishing semiconductor wafer 13, the semiconductor wafer 13 is so held as to face downward by means of a wafer holding head 11, and then the semiconductor wafer 13 held by the wafer holding head 11 is brought into sliding contact with a polishing pad 15. When holding the semiconductor wafer 13 by the wafer holding head 11, the backing pad 12 is interposed between the wafer holding head 11 and the semiconductor wafer 13. The backing pad 12 is formed of a non-porous rubber material having a JIS-A hardness of 65-83, and the ratio of the diameter to that of the semiconductor wafer 13 is 1.015 or above, letting the diameter of the semiconductor wafer 13 be 1. With one face 13a of the semiconductor wafer 13 in contact with the backing pad 12, the other face 13b is brought into sliding contact with the polishing pad 15. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
