发明名称 PROCESS FOR PRODUCING MODULAR SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a process for producing a modular substrate capable of obtaining a highly reliable modular substrate at a low cost. <P>SOLUTION: On a ceramic substrate 1 provided with splitting grooves 2 for partitioning a plurality of modules each mounting a component 3, a resin layer 4 of curing resin is formed on the substantially entire surface. After the resin layer 4 is cured temporarily, incising grooves 5 are formed from the surface of a resin layer 4a to the splitting groove 2 in correspondence with the splitting groove 2 and then the resin layer 4a is cured actually. Thereafter, the ceramic substrate 1 is divided into individual modules by the splitting groove 2 and the incising groove 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004349281(A) 申请公布日期 2004.12.09
申请号 JP20030141218 申请日期 2003.05.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YUHAKU SEI;NAKATANI SEIICHI
分类号 H05K3/28;H01L21/56;H01L23/12;H05K1/02;H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/28
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