发明名称 |
PROCESS FOR PRODUCING MODULAR SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a process for producing a modular substrate capable of obtaining a highly reliable modular substrate at a low cost. <P>SOLUTION: On a ceramic substrate 1 provided with splitting grooves 2 for partitioning a plurality of modules each mounting a component 3, a resin layer 4 of curing resin is formed on the substantially entire surface. After the resin layer 4 is cured temporarily, incising grooves 5 are formed from the surface of a resin layer 4a to the splitting groove 2 in correspondence with the splitting groove 2 and then the resin layer 4a is cured actually. Thereafter, the ceramic substrate 1 is divided into individual modules by the splitting groove 2 and the incising groove 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2004349281(A) |
申请公布日期 |
2004.12.09 |
申请号 |
JP20030141218 |
申请日期 |
2003.05.20 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YUHAKU SEI;NAKATANI SEIICHI |
分类号 |
H05K3/28;H01L21/56;H01L23/12;H05K1/02;H05K3/00;(IPC1-7):H05K3/00 |
主分类号 |
H05K3/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|