| 摘要 |
<p>A process for molding a synthetic resin, characterized by conducting the molding (1) by the use of a main metal mold constituting a mold cavity covered with a heat insulating layer in a state closely adherent to the mold surface in which a heat insulating layer made of a heat-resistant polymer having a thickness of more than 0.1 mm but below 0.5 mm covers the mold surface, and a metal layer covers the heat insulating layer in a state closely adherent to the insulating layer, (2) under the conditions that the integral [(mold surface temp.)-(softening temp. of the synthetic resin)] value (ΔH) over the period in which the mold surface temperature equals or exceeds the softening temperature of the synthetic resin after the point of time when the resin to be molded has come into contact with the mold surface is 2 sec. °C or above, and/or that the integral [mold surface temp.-(softening temp. of the synthetic resin - 10 °C)] value (Δh) over the period in which the mold surface temperature equals or exceeds the softening temperature (°C) of the synthetic resin minus 10 after the above point of time is 5 sec. °C or above, and (3) under the condition that the mold surface temperature lowers to the softening temperature of the resin or below after 5 seconds from the point of time when the resin to be molded has come into contact with the mold surface.</p> |
