发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device which has a high breakdown voltage transistor having a high junction breakdown voltage characteristics, and a low voltage transistor having high current drive characteristics and which secures element isolation performance in both the transistor forming regions. SOLUTION: The semiconductor device has the high breakdown voltage transistor (a) and the low voltage transistor (b) having different sidewall widths. The sidewall of the high breakdown voltage transistor (a) is formed by laminating four layers of a first sidewall film 12, a second sidewall film 13, a third sidewall film 14 and a fourth sidewall film 21 from both the sidewalls of a gate electrode 10a toward a side. The sidewall of the low voltage transistor (b) is formed by laminating three layers of the first sidewall film 12, the second sidewall film 13 and the fourth sidewall 21 from both side faces of a gate electrode 10b toward the side. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004349377(A) 申请公布日期 2004.12.09
申请号 JP20030143113 申请日期 2003.05.21
申请人 SHARP CORP 发明人 FUJIO MASAYUKI;ARIMURA KIMIHARU
分类号 H01L21/336;H01L21/8234;H01L21/8238;H01L21/8247;H01L27/088;H01L27/092;H01L27/10;H01L27/115;H01L29/78;H01L29/788;H01L29/792;(IPC1-7):H01L21/823;H01L21/823;H01L21/824 主分类号 H01L21/336
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