发明名称 METALLIZATION FILM CAPACITOR, ITS ASSEMBLY, AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To solve the problems wherein a current value, which is required for a method of solder bonding or resistance welding of conventional leads or lead pieces, is insufficient for connecting lead electrodes of a capacitor used for a high-frequency and large-current circuit, and, in sufficient case, reliability in capacitor characteristics is reduced because of thermal effects on capacitor elements, caused by soldering of metal bars or the like. SOLUTION: The metal bar 3 having a cross sectional area required for a circuit is permitted to serve as the lead electrode to be jointed to the capacitor element 1 to obtain a structure to which a large current is applicable. Further, a protrusion 3-2 for solder bonding is provided at the metal bar 3, whereby thermal effects on the capacitor element 1 is reduced because only a solder bonding region 3-3 is heated at the time of solder bonding. Thus, reliability is ensured in the bonding of the lead electrode and in capacitor characteristics. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004349447(A) 申请公布日期 2004.12.09
申请号 JP20030144471 申请日期 2003.05.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAGAI MASAHITO;HOSOKAWA SATOSHI
分类号 H01G4/18;H01G4/38;(IPC1-7):H01G4/18 主分类号 H01G4/18
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