METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND CONVEYING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the rate of being occupied by the footprint of a stocker in a semiconductor manufacturing line. SOLUTION: When a FOUP (front opening unified pod) FP which holds a wafer is stocked in a storage room SR, a working area which was required to install a transfer mechanism in a bay station to a simple placing structure by using means for disposing the FOUP FP in the storage room SR by hand without using the transfer mechanism like a pick and place type conveyor or a sliding mechanism. Thus, the footprint of the bay station BS is reduced by the part of the working area. COPYRIGHT: (C)2005,JPO&NCIPI