发明名称 |
System of path planning for robotic manipulators based on maximum acceleration and finite jerk constraints |
摘要 |
A system for wafer handling employing a complex numerical method for calculating a path of wafer travel that controls wafer acceleration and jerk, and results in maximum safe speed of wafer movement from a first point to a second point. Motion is begun along a straight line segment while accelerating to a first path velocity. During this acceleration, the system computer calculates a series of straight line segments and interconnecting sinusiodally shaped paths over which the wafer is to be guided to the second point. The straight line segments and sinusiodally shaped paths are calculated so as to minimize total path length and the time required to move the wafer from the first point to the second point. The system computes the point of entrance and exit to and from each straight and sinusoidal path.
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申请公布号 |
US2004249509(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20040830974 |
申请日期 |
2004.04.22 |
申请人 |
ROGERS JOHN;PADMANABHAN PRASAD;SAGUES PAUL |
发明人 |
ROGERS JOHN;PADMANABHAN PRASAD;SAGUES PAUL |
分类号 |
B25J9/16;G05B19/4103;G06F19/00;(IPC1-7):G06F19/00 |
主分类号 |
B25J9/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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