| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a multi-layered circuit board (mother board, semiconductor chip mounting board), a semiconductor package and the like, which are capable of securing a bonding strength between an interlayer insulating layer and a wiring without forming recesses and projections of a degree of exceeding 1 μm on the surface of the wiring, and capable of transmitting a high-speed electric signal efficiently. <P>SOLUTION: The manufacturing method of the multi-layered wiring board, having a plurality of layers of the interlayer insulating layer and the wiring formed on one side or both sides of a core substrate, includes a process for treating the surface of the wiring with the solution of a compound containing an amino group in the molecule thereof or containing an imidazole group in the molecule thereof, and a process for forming the interlayer insulating layer by curing a resin composition containing an isocyanate ester compound. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
