SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD, CIRCUIT BOARD AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To increase the degree of freedom of wiring formation. SOLUTION: This semiconductor device has: a semiconductor substrate 10 having a plurality of electrodes 14; a plurality of lands 20; and a plurality of wirings 26 electrically connecting a plurality of the electrodes 14 to a plurality of the lands 20. A plurality of the lands 20 include long lands 22 having a shape long along a longitudinal direction of any wiring 26. COPYRIGHT: (C)2005,JPO&NCIPI