发明名称 METHOD AND APPARATUS FOR INSPECTING FILM BONDING POSITION
摘要 PROBLEM TO BE SOLVED: To easily inspect whether a film is accurately bonded to the normal position of a base surface, such as paper and plastic, by an inexpensive means. SOLUTION: A method for inspecting film bonding positions comprises a non-bonding region formation process (A) for forming a non-bonding region at least at one end edge 12 of the film 11 bonded to the surface of a base 1; a film end edge raising process (B) for blowing air 22 from an air injection nozzle section 21 to the lower surface of the film 11 at the non-bonding region for raising one end edge 12 from the surface of the base 1; a film end edge detection process (C) for imaging the one end edge 12 of the raised film by a digital image pick-up means 41; an image recording process (D) for recording the digital image of the imaged one end edge 12 of the film; an image data reading process (E) for reading the recorded digital image as numeric data; and a film bonding position quality determination process (F) for determining the quality of the film bonding state, based on the read result. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004347393(A) 申请公布日期 2004.12.09
申请号 JP20030143067 申请日期 2003.05.21
申请人 TOPPAN PRINTING CO LTD 发明人 ASANO TAKUMI
分类号 G01B11/00;B65B57/02;(IPC1-7):G01B11/00 主分类号 G01B11/00
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