| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for polishing a wafer by which the deterioration of haze due to long-term use of a polishing cloth can be prevented, the service life thereof can be made longer, and the wafer can be polished at an appropriate hase level in finish polishing. <P>SOLUTION: The polishing device 10a is provided with a polishing plate 14 where a polishing cloth is adhered to the surface thereof, a polishing head 18 that holds one surface of a wafer W to be polished to a holding surface 16a and brings the other surface thereof to the polishing cloth 12, and a head driving mechanism that drives the polishing head 18 to polish the other surface thereof by the polishing cloth 12. A holder 17 for controlling the supply amount of a polishing agent is provided adjacent to the outer circumference of the polishing head 18 at a specified distance d, and the holder 17 is provided with a contact surface in contact with the polishing cloth 12. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
