| 摘要 |
PROBLEM TO BE SOLVED: To enhance the soldered part of a chip light emitting diode in joining strength so as to markedly improve the light emitting diode in reliability by a method wherein resin is prevented from flowing into a through-hole keeping the diode small in size, and a side electrode provided inside the through-hole is used for soldering the light emitting diode to a printed board. SOLUTION: A chip light emitting diode has such a structure that a through- hole 24 is provided to the side face of an insulating board 21 to electrically connect a front-side electrode 22 and a rear-side electrode 23 together, a light emitting diode 25 is mounted on the front-side electrode 22 and bonded with a metal fine wire 26, and the light emitting diode 25 and the metal fine wire 26 are sealed up with light transmitting resin 27, wherein the upper opening of the through-hole 24 is stopped up with a flange 28 provided to the front-side electrode 22. |
