发明名称 CHEMICALLY AMPLIFYING PHOTORESIST LAYER LAMINATE, METHOD FOR MANUFACTURING PHOTORESIST LAYER LAMINATE, METHOD FOR MANUFACTURING PHOTORESIST PATTERN AND METHOD FOR MANUFACTURING CONNECTING TERMINAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a stable chemically amplifying photoresist layer laminate which does not change its alkali solubility before irradiation with radiation, to provide a method for manufacturing a photoresist pattern by using the laminate, and to provide a method for manufacturing a connecting terminal. <P>SOLUTION: The photoresist laminate is obtained by laminating on a supporting body: (a) a resin which changes its alkali solubility by an acid; and (b) a photoresist layer comprising a chemically amplifying photoresist composition containing a compound which generates an acid by being irradiated with radiation. Copper is used for at least a part of the upper face side of the supporting body, and a copper oxide film is formed on the surface of the copper. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004347950(A) 申请公布日期 2004.12.09
申请号 JP20030146230 申请日期 2003.05.23
申请人 TOKYO OHKA KOGYO CO LTD 发明人 WASHIO YASUSHI;SAITO KOJI
分类号 G03F7/09;G03F7/038;G03F7/039 主分类号 G03F7/09
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