| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrophotographic composition and an electrophotographic dry film which ensure wide latitude to dislocation in exposure, can simply and reliably form a landless hole which easily increases wiring density, and achieve good image reproducibility, when a printed wiring board having a through hole or/and a non-through hole is manufactured, and to provide a method for manufacturing a printed wiring board by an electrophotographic process using the same. SOLUTION: The electrophotographic composition contains at least an electrophotographic sensitive material, an alkali-soluble resin and a heterocyclic mercaptan compound and may further contain a second resin component. The electrophotographic dry film comprises the electrophotographic composition. In the method for manufacturing a printed wiring board by an electrophotographic process, an electrophotographic sensitive layer is formed on both sides of a circuit forming substrate except a hole aperture by using the electrophotographic dry film. COPYRIGHT: (C)2005,JPO&NCIPI
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