发明名称 |
Dual pitch contact pad footprint for flip-chip chips and modules |
摘要 |
An electronic device, including: a plurality of contacts pads on a surface of a substrate; the contacts pads spaced apart a first predetermined distance in a first direction; and the contact pads spaced apart a second predetermined distance in a second direction, the first predetermined distance different from the second predetermined distance, the first direction perpendicular to the second direction.
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申请公布号 |
US2004246691(A1) |
申请公布日期 |
2004.12.09 |
申请号 |
US20030455982 |
申请日期 |
2003.06.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUDELL TIMOTHY W.;STONE DAVID B.;ZALESINSKI JERZY M. |
分类号 |
H01L23/498;H05K1/11;(IPC1-7):H05K7/10;H05K7/12 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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