| 摘要 |
The present invention is directed to a highly reliable optical semiconductor device (1), which comprises an optical semiconductor chip (2) sealed in a surrounding soft resin (3) and in a hard resin (4) harder than the soft resin. The hard resin (4) has an aperture (7b) configured to relieve a state of hermetic sealing for the soft resin (3) and formed in a direction that imposes no optical influence on a function of the optical semiconductor chip (2). The soft resin (3) and the hard resin (4) are employed for double sealing to form the highly reliable optical semiconductor device (1) without providing any space. This is effective to solve a problem caused in a conventional optical semiconductor device associated with double sealing by soft and hard resins to increase reliability, which requires a space between both resins and results in deteriorated performance, for example, a reduced amount of light.
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