发明名称 Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board
摘要 <p>The distance between the edges (52,53,59,60) of circuit components (51,54,55,61,73) and adhesive lines (56,57,58,62,63) parallel to edge, and quantity of adhesive to be applied along the line, are selected based on which adhesive is applied along the adhesive lines, after which circuit components are placed on the circuit board. An independent claim is also included for device for applying adhesive on circuit board.</p>
申请公布号 DE102004002274(A1) 申请公布日期 2004.12.09
申请号 DE20041002274 申请日期 2004.01.16
申请人 MARCONI COMMUNICATIONS GMBH 发明人 KONRATH, WILLIBALD;SCHOLL, KLAUS;SCHMELCHER, HAIKO;MUELLER, ULF
分类号 H05K3/30;H05K13/04;(IPC1-7):H05K3/32 主分类号 H05K3/30
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