发明名称 |
METHOD OF MANUFACTURING DEFLECTABLE MICROSTRUCTURE THROUGH BONDING OF WAFERS |
摘要 |
<p>A method of making a deflectable, free hanging micro structure having at least one hinge member, the method includes the steps of providing a first sacrificial wafer having a single crystalline material constituting material forming the micro structure. A second semiconductor wafer including necessary components for forming the structure in cooperation with the first wafer is provided. Finite areas of a structured bonding material is provided, on one or both of the wafers at selected locations, the finite areas defining points of connection for joining the wafers. The wafers are bonded using heat and optionally pressure. Sacrificial material is etched away from the sacrificial wafer, patterning the top wafer by lithography is performed to define the desired deflectable microstructures having hinges, and subsequently silicon etch to make the structures.</p> |
申请公布号 |
EP1483196(A1) |
申请公布日期 |
2004.12.08 |
申请号 |
EP20030705598 |
申请日期 |
2003.02.14 |
申请人 |
SILEX MICROSYSTEMS AB |
发明人 |
KÄLVESTEN, EDVARD;EBEFORS, THORBJÖRN;SVEDIN, NIKLAS;WESTIN, HÅKAN |
分类号 |
B81C1/00;B81B3/00;B81B7/04;B81C3/00;G02F1/29;H01L21/00;H01L21/30;H01L21/302;H01L21/46;H01L21/461;(IPC1-7):B81B3/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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