| 摘要 |
PROBLEM TO BE SOLVED: To avoid forming burr at the terminal end of the process, by applying a residual stress to a scribe region on a wafer having a circuit pattern to avoid inducing the thermal stress concentration and scanning a laser beam along the scribe region for scribing the wafer. SOLUTION: Before scribing by the irradiation of a laser beam, the front face 1a or back face 1b of a wafer 1 having a circuit pattern is very faintly denatured by melting and rehardening or very faintly deformed by applying a force along preliminary residual stress lines 21 e.g. microgrooves at the end lines of the width of a scribe region 3 at high accuracy. Or preliminary residual stress lines 22 and 23 formed along one end line of the width of the region 3 on the front face 1a of the wafer 1 having a circuit pattern and along the other end line on the back face 1b of the wafer 1 at high accuracy, respectively. Or preliminary residual stress lines 21 and 24 are formed along the end lines of the width of the region 3 on the front and back faces 1a and 1b of the wafer 1 having a circuit pattern at high accuracy. |
