| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method suited for mounting electronic parts to be face- down-bonded to a multilayered board, utilizing a transmitted laser beam. SOLUTION: After mounting parts separately on a laser beam-transmitting board 2 and multilayered board 3, both boards are faced to each other and electrically bonded into a unified board. Hence, even such electronic parts 1 as those impossible to be directly mounted on the multilayered board 3 but needing the face-down bonding utilizing a transmitted laser beam can be reliably mounted at desired positions on the multilayer board 3 through the board 2. Thus it is possible to handle the bonded two boards 2 and 3 as a unified board and obtain a high-mounting density board.</p> |
