| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the cooling efficiency of a card-like electronic component by transmitting heat generated on the surface of the card-like electronic component to a solid pattern for radiating heat on a mounted substrate and radiating the heat from the mounted substrate. SOLUTION: The solid pattern for radiating the heat is formed on the mounted substrate 2 for mounting the card-like electronic component and it is brought into contact with the surface of the card-like electronic component 1 through an appropriate heat transmitting body 7. The solid pattern for radiating the heat is provided so as to enlarge the heat capacity of the entire mounted substrate 2, enlarge an area exposed to outdoor air and improve a heat radiating effect and is desired to be formed in the area almost equal to or more than the projecting area to the mounted substrate 2 of the card-like electronic component 1. Thus, the heat generation in the card-like electronic component 1 is immediately absorbed to the side of the mounted substrate 2, the heat is radiated from the solid pattern for radiating the heat and the card-like electronic component 1 is cooled.</p> |
