GAS INJECTION APPARATUS FOR INJECTING UNIFORMLY SOURCE AND REACTION GASES ON ENTIRE SURFACE OF WAFER

摘要

PURPOSE: A gas injection apparatus for injecting uniformly source and reaction gases on an entire surface of a wafer is provided to inject uniformly a process gas on an upper surface of the wafer by changing shapes between an inner plate and an outer plate to control a flow direction and a flow angle of the process gas. CONSTITUTION: An inner plate(144) is coupled to an outer circumference of a susceptor(132) on which a wafer is loaded. An outer plate is installed at a predetermined position apart from the inner plate. A gas injector includes a gas inflow hole formed in a process chamber, a gas injection hole at one end of the gas inflow hole, and a gas inflow path(146) formed between the inner plate and the outer plate.