Electronic component with side contacts and associated method of fabrication

摘要

A method for manufacturing an electronic component includes forming an aggregate electronic component (11) including a plurality of electronic components (1) and dividing the aggregate electronic component (11) to separate the plurality of electronic components (1) to form individual electronic components (1). Through-holes (24) are formed in a laminated body providing an aggregate electronic component (11) wherein via-hole conductors are arranged so as not pass through the aggregate electronic component (11) in a thickness direction thereof, the via-hole conductors are divided by the through-holes (24), and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines (12) passing through the through-holes (24), a plurality of individual electronic components (1) are produced.