发明名称 APPARATUS AND A METHOD FOR TRANSFERRING A SUBSTRATE TO TRANSFER A LARGE SIZED SUBSTRATE WITHOUT BEND OF THE SUBSTRATE AND AN APPARATUS FOR A VACUUM TREATMENT
摘要 PURPOSE: An apparatus and a method for transferring a substrate and an apparatus for a vacuum treatment are provided to transfer a large sized substrate without bend of the substrate by supporting both the edge portion and the inside portion of the substrate. CONSTITUTION: An apparatus for transferring a substrate comprises a substrate transfer unit(70) and a substrate exchange unit(80). The substrate transfer unit transfers a substrate(G) between the first room(20) and the second room(10). The substrate exchange unit has the first support elements(81,82) for supporting the edge of the substrate and the second support element(85) for supporting the inside of the substrate. The substrate exchange is installed in the first room, where the substrate exchange unit performs the exchange of the substrate between the substrate transfer unit and an another substrate transfer unit.
申请公布号 KR20040103379(A) 申请公布日期 2004.12.08
申请号 KR20040037940 申请日期 2004.05.27
申请人 TOKYO ELECTRON LIMITED 发明人 NAKAYAMA, HIDEKI
分类号 B65G49/06;B25J9/06;B65G49/07;G02F1/13;H01L21/3065;H01L21/677;H01L21/68;(IPC1-7):G02F1/13 主分类号 B65G49/06
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