| 摘要 |
<p>Joining lines (2) of adhesive alimentary material such as chocolate are formed on products such as hemispherical wafer half-shells (1), the respective opening portions (1a) of which are to be joined together. For this purpose, the adhesive material is applied to a transfer surface in the form of a substantially continuous layer or in the form of piping (C) of a shape representing the shape of the joining line (2) to be formed. The opening portions (1a) of the products (1) are then dipped in the continuous layer or piping of adhesive alimentary material (C). <IMAGE></p> |
