| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a resin-molded package, which is provided with a metal shield on its outer surface and easily manufactured at a low cost. SOLUTION: A resin-molded package 30 providing an electronic circuit therein is formed, the tip of a rod 2 of zinc or aluminum is melted by heating with an arc discharge or the like, an air flow 7 is made to blow against the melt tip of the rod 2 to form a fog of zinc or aluminum 3, and the fog of zinc or aluminum 3 is attached to the outer surface of the resin-molded package 30 by the flow of air 7 for forming a metal-shielding film 1. |
