发明名称 |
Method and apparatus for removing heat from a circuit |
摘要 |
An apparatus includes a circuit (47) having a heat-generating circuit component, and structure for guiding a two-phase coolant along a path which brings the coolant into direct physical contact with either the circuit component or a highly thermally conductive part (121,122) which is thermally coupled to the circuit component. The coolant absorbs heat generated by the circuit component, at least part of the coolant changing from a first phase to a second phase in response to the heat absorbed from the circuit component, where the second phase is different from the first phase. <IMAGE> |
申请公布号 |
EP1381083(A3) |
申请公布日期 |
2004.12.08 |
申请号 |
EP20030254283 |
申请日期 |
2003.07.05 |
申请人 |
RAYTHEON COMPANY |
发明人 |
HAWS, JAMES L.;WYATT, WILLIAM GERALD;KVIATKOFSKY, JAMES F.;DENNISTON, DAVID B. |
分类号 |
H01L23/427;H01Q1/02;H01Q21/00;H05K7/20;(IPC1-7):H01L23/427 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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