发明名称 |
SEMICONDUCTOR DEVICE HAVING TRANSISTOR STRUCTURE WHICH INCLUDES GATE OXIDE LAYER AND GATE INSULATING LAYER FORMED ON SILICON SUBSTRATE, AND FABRICATING METHOD THEREOF |
摘要 |
<p>PURPOSE: A semiconductor device transistor structure which includes a gate oxide layer and a gate insulating layer formed on a silicon substrate, and a fabricating method thereof are provided to prevent the damage of the silicon substrate, caused by injecting F ions, and effectively reduce a boundary level between a gate insulating layer and the silicon substrate. CONSTITUTION: A source and a drain are formed on an upper surface of a silicon substrate. A gate insulating layer is formed between the source and the drain. A gate electrode is formed on the gate insulating layer. A fluoric termination part including Si-F bond is formed around a boundary between the gate insulating layer and the silicon substrate. The content of atom F of the fluoric termination part has a peak value in the vicinity of the boundary between the gate insulating layer and the silicon substrate. In addition, the content of atom F of the fluoric termination part is more than 1x10¬20cm¬-3.</p> |
申请公布号 |
KR20040103455(A) |
申请公布日期 |
2004.12.08 |
申请号 |
KR20040038609 |
申请日期 |
2004.05.29 |
申请人 |
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC. |
发明人 |
OZAKI, HIROJI;SASAKI, TAKAOKI |
分类号 |
H01L21/265;H01L29/78;(IPC1-7):H01L29/78 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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