| 摘要 |
The present invention discloses a package and electrode structure of a light emitting diode and a light source of full color LED by using die bonding and packaging technology. A silicon dioxide film and a reflective metal layer of gold germanium or gold alloy, is formed around the chip or forming a grove around the die to decrease the electric field near the scribe line. Bonding pad(s) are formed on one side of the chip. In a near field application, a red, a blue and a green LED are die-bonded in cascade to get a white light or full color light. In a far field application, a yellow and a blue LED are die bonded in cascade on a board, in its side is another cascaded die bond of a red and a green LED to get white or full color light. <IMAGE> |
