| 摘要 |
A compact optoelectronic module that prevents undesirable heating by locating the electrical drive and/or receiving (control) circuit outside of the housing containing the optoelectronic transducer. The control circuit is mounted on a submount (PCB). The housing is mounted on the submount adjacent to the control circuit, and the optoelectronic transducer is coupled to the control circuit via a mount (leadframe) that extends substantially perpendicular to the submount plane and is surface mounted on the submount. The housing includes an opening, and a lens is provided between the optoelectronic transducer and the opening and defines an optical axis that is parallel to the submount plane. An encapsulating body is used to secure the optoelectronic transducer and mount inside the housing, and a portion of the encapsulating material is used to form the lens. |
