发明名称 |
Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method |
摘要 |
A centering unit comprises a plate (232), centering mechanism (234), link mechanism (234C), and cylinder mechanism (234D). The plate (232) vertically divides the interior of a frame (231). The support table (233) is located substantially on the center of the plate (232). The centering mechanism (234) can center each wafer (W) on the support table (233). Centering plates (234A) of the centering mechanism (234) are located on either side of the support table (233) and have engaging surfaces (234E) and (234F) that extend along the outer peripheral surface of the wafer (W). The link mechanism (234C) and the cylinder mechanism (234D) serve to extend and contract the space between the centering plates (234A). <IMAGE> <IMAGE> |
申请公布号 |
EP1331659(A3) |
申请公布日期 |
2004.12.08 |
申请号 |
EP20030001451 |
申请日期 |
2003.01.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;TOKYO ELECTRON LIMITED |
发明人 |
KANG, KI SANG;AKIYAMA, SHUJI;HOSAKA, HIROKI |
分类号 |
H01L21/68;H01L21/00;H01L21/687;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/68 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|