| 摘要 |
The present invention relates to a method for reducing low-frequency noise in a cooled circuit wherein low-frequency noise in a cryogenic semiconductor device is reduced by carrying out thermal cure. The semiconductor device is turned on at a first temperature, and the temperature of the semiconductor device is temporarily raised, while flowing current in the semiconductor device, to a second temperature that is higher than the first temperature, and then cooling the temperature of the semiconductor device from the second temperature to a cryogenic temperature, at which the semiconductor device can operate. |
