发明名称 |
Method of reducing an electrostatic charge on a substrate during a PECVD process |
摘要 |
Provided herein is a method of reducing an electrostatic charge on a substrate during a plasma enhanced chemical vapor deposition process, comprising the step of depositing a conductive layer onto a top surface of a susceptor support plate disposed within a deposition chamber wherein the conductive layer dissipates the electrostatic charge on the bottom surface of the substrate during a plasma enhanced chemical vapor deposition process. Also provided are a method of depositing a thin film during a plasma enhanced chemical vapor deposition process using the methods disclosed herein and a conductive susceptor.
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申请公布号 |
US6827987(B2) |
申请公布日期 |
2004.12.07 |
申请号 |
US20010927698 |
申请日期 |
2001.07.27 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
WON TAE KYUNG;CHOI SOO YOUNG;TAKEHARA TAKAKO;HARSHBARGER WILLIAM R. |
分类号 |
C23C16/458;(IPC1-7):H05H1/24 |
主分类号 |
C23C16/458 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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