发明名称 Module component
摘要 A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.
申请公布号 US6828670(B2) 申请公布日期 2004.12.07
申请号 US20030433843 申请日期 2003.06.09
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HAYAMA MASAAKI;HIGASHITANI HIROSHI
分类号 H05K3/46;G06K19/077;H01F17/00;H01F27/40;H01L21/48;H01L23/538;H01L25/00;H05K1/00;H05K1/16;H05K1/18;(IPC1-7):H01L23/053 主分类号 H05K3/46
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