发明名称 |
Semiconductor device with high- and low-density regions of transistor elements on single semiconductor substrate, and method of manufacturing such semiconductor device |
摘要 |
A semiconductor device manufacturing process for forming a semiconductor device having a high density region and a low density region of transistor elements, includes forming a gate oxide film and gate electrodes on a semiconductor substrate surface. Then, a first nitride film is uniformly formed on the gate electrodes, and only the low-density region of the semiconductor device is etched. Then, a second nitride film is uniformly formed, and then an interlayer insulating film is formed. The high-density region is self-aligned using the first nitride film as an etch stopper to form contact holes in the interlayer insulating film, and contact electrodes are formed In the contact holes. The assembly is then annealed by a forming gas to recover an interfacial layer.
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申请公布号 |
US6828188(B2) |
申请公布日期 |
2004.12.07 |
申请号 |
US20000741195 |
申请日期 |
2000.12.21 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
HIROTA TOSHIYUKI;SATO NATSUKI |
分类号 |
H01L21/8234;H01L21/8242;H01L27/088;H01L27/108;(IPC1-7):H01L21/823 |
主分类号 |
H01L21/8234 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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