| 摘要 |
<p>PURPOSE: A wire bonding apparatus is provided to measure exactly the temperature of a heater block without temporary stopping of the apparatus by using a temperature measuring unit. CONSTITUTION: A wire bonding apparatus includes a capillary, a tip for high voltage discharge, a heater block, a bonding block, a temperature controller, and a display unit for transfered temperature. The capillary(21) is used for connecting a frame with a chip using a bonding wire. The tip(22) is spaced apart from the capillary. The heater block(23) is used for loading the frame. The bonding block(24) with an opening is installed on the heater block to support the frame. The temperature controller(25) is used for transferring heat to the heater block. The display unit(26) is used for displaying the temperature of the heat transferred from the temperature controller. A temperature measuring unit(30) is installed on the heater block to measure the temperature of the heater block. A display unit(31) for measured temperature is connected with the temperature measuring unit to display the temperature of the heater block.</p> |
