| 摘要 |
PURPOSE: A method of mounting an electronic component, a structure for mounting an electronic component, an electronic component module, and an electronic apparatus are provided to achieve improved reliability of electrical connection between the electronic component and a substrate. CONSTITUTION: A substrate(60) includes a through hole(63) extended from connection electrodes(62,68) formed on a lower surface of the substrate, to an upper surface of the substrate; and a low melting point metal(64) connected to the connection electrodes and fills the through hole. A bump(44) and the low melting point metal are alloy-bonded by pressing the bump formed on an electrode pad(42) of an electronic component(40) with respect to a top of the low melting point metal, and heating the low melting point metal. |
