DEFECT DETECTING APPARATUS AND METHOD USING LASER BEAMS WITH VARIOUS INCIDENT ANGLES ON WAFER

摘要

PURPOSE: A defect detecting apparatus and its method are provided to detect exactly lower defects of a wafer by using a plurality of laser beams with various incident angles on the wafer. CONSTITUTION: A defect detecting apparatus includes a laser beam source, a light transformation part, and a detecting part. The laser beam source(20) generates a laser beam with one incident angle on a wafer(W). The light transformation part(40) transforms the laser beam into a plurality of laser beams with various incident angles on the wafer. The detecting part(60) receives a plurality of beams reflected from the wafer and detects defects of the wafer by using the plurality of reflected beams.