| 发明名称 |
Piezoelectric sensor for measuring bonding parameters. |
| 摘要 |
A sensor for an ultrasonic bonding apparatus comprises a piezoelectric material located between the ultrasonic transducer and an ultrasonic concentrator of the bonding apparatus. The sensor has at least two outputs for measuring different bonding parameters, the outputs being chosen to optimize the signal response for the bonding parameters in question. |
| 申请公布号 |
HK1040951(A1) |
申请公布日期 |
2004.12.03 |
| 申请号 |
HK20020100986 |
申请日期 |
2002.02.07 |
| 申请人 |
ASM ASSEMBLY AUTOMATION LIMITED |
发明人 |
LAI WA CHAN-WONG;SIU SAN CHIU;SIU WING OR;YIU MING CHEUNG |
| 分类号 |
G01L5/00;B23K20/10;H01L21/60;H04R17/00 |
主分类号 |
G01L5/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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